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2K views · 33 reactions | High bandwidth memory (HBM) is more than a buzzword — it’s powering the next wave of AI breakthroughs. We aim to improve advanced packaging, a crucial step in the HBM manufacturing process. So where does advanced packaging fit into the equation? Find out from Semiconductor Digest. ⬇️ https://bit.ly/3JwZ0CM | Lam Research Corporation | Facebook

3.3K views · 62 reactions | Our cutting-edge advanced packaging technologies make High Bandwidth Memory (HBM) a reality for #GenAI devices. Discover why solutions like 2.5D and 3D integration are critical for enabling the third generation of HBM and providing high-speed access to vast data sets for #AI training. https://bit.ly/47ekrAC | Lam Research Corporation | Facebook