Abstract: Solder joint voids are usually formed by the entrapped gas bubbles during the reflow process and are common in all surface mount applications. It is a controversial issue on the reliability ...

Abstract: The rapid growth in the global market for semiconductor power electronics has intensified the requirement for better reliability quality at the solder interconnect that demands small or zero ...

Learn how to master Windows PowerShell scripting to automate repetitive tasks, manage systems efficiently, and streamline your workflow on Windows 11. This beginner-friendly tutorial shows the ...

You have some fine pitch soldering to do, but all you have on hand is a big soldering iron. What do you do? There are a few possible answers, but [Mr SolderFix] likes to pull a strand from a large ...