Microsoft Corporation ( MSFT) Q1 2026 Earnings Call October 29, 2025 5:30 PM EDT Greetings, and welcome to the Microsoft Fiscal Year 2026 First Quarter Earnings Conference Call. [Operator Instructions ...
At its inaugural SAP Connect event, SAP showcased how the integration of AI, data, and applications creates unparalleled business value. These breakthroughs-including a new network of role-based ...
SAP SE remains overvalued despite a recent correction, with growth rates and cloud backlog decelerating and high expectations ...
SAP , Europe's largest software provider, offered to buy accounting software firm BlackLine for nearly $4.5 billion in June ...
CHICAGO , Oct. 07, 2025 (GLOBE NEWSWIRE) — Bectran, Inc., the connected intelligence platform for end-to-end credit, collections, and AR management, has announced the addition of advanced AI-assisted ...
Now that SAP has completed its acquisition of SmartRecruiters, executives are talking about their plans to replace the recruiting module of SuccessFactors, SAP’s cloud-based HR management tool. Now, ...
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SAP unveils next-gen AI to transform businesses
Global enterprise software company SAP SE has unveiled a new generation of artificial intelligence tools designed to change the way businesses operate. The announcement came at the company’s inaugural ...
The Joint Entrance Examination (JEE) Mains session one registration 2026 link is jeemain.nta.nic.in, the candidates who wish to apply for JEE Main can do so on the official website- jeemain.nta.nic.in ...
Viksit Bharat Buildathon 2025: Top 10,000 entries will receive national recognition Viksit Bharat Buildathon Registration 2025: The Ministry of Education, in partnership with the Atal Innovation ...
New SaaS application transforms static hazard assessments into dynamic, data-driven risk management across industrial enterprises Wolters Kluwer today announced the launch of Enablon Process Hazard ...
Expand your understanding of food systems as a Civil Eats member. Enjoy unlimited access to our groundbreaking reporting, engage with experts, and connect with a community of changemakers. The first ...
As demand grows for high-performance computing (HPC) and AI-driven applications, manufacturers are turning to hybrid bonding to enable the ultra-dense 3D integration required for next-generation chip ...
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