Abstract: We describe here Intel's 14nm high-performance logic technology interconnects and back end stack featuring 13 metal layers and a tri-metal laminated metal-insulator-metal (MIM) capacitor.
We have a vibrant community of developers helping each other in our Telegram group. Join us! Stay tuned for library updates and new releases on our Telegram Channel. This library provides a pure ...
Anduril founder Palmer Luckey admits he likes to hire people with experience off the beaten path—and he’s now scouting new ...
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