Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are ...

India has approved several electronic component manufacturing projects, underscoring its push up the tech supply chain, while ...

High Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member. "International collaboration across market segments is instrumental to address ...

DuPont de Nemours is not a name you'd likely expect to hear in the same sentence as "semiconductors." Yet, for decades, the ...

A printed circuit board (PCB) is used for electrical interconnection and as a component assembly platform in electronic devices. Aspocomp provides PCB technology design, testing and logistics services ...

High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member. ...we look forward to contributing to HDP initiatives ...

Aspocomp Group Plc, Stock Exchange Release, November 3, 2025, at 9:00 a.m. (UCT+2) Release category: Other information disclosed according to the rules of the Exchange Aspocomp's Board of Directors ha ...

A total of 673,682 new shares subscribed for in Aspocomp’s Directed Share Issue have been registered with the Finnish Trade Register on October 31, 2025. After the registration of the new shares, the ...

The Production Linked Incentive (PLI) scheme is transforming India's Electronics Manufacturing Services (EMS) sector into a global hub, significantly boosting domestic production and investment. This ...

The recalls are split between a handul of 2025 models and quite a bit more 2023 and 2024 models produced for the US market ...

Aspocomp Group Plc, Stock Exchange Release, November 3, 2025 at 9:30 p.m. Aspocomp Group Plc (business ID 1547801-5) received today, on November 3, 2025 a notification of major shareholding, pursuant ...