Adeia has filed a pair of patent infringement lawsuits against AMD in the U.S. District Court for the Western District of ...

AMD is facing two patent infringement lawsuits filed by Adeia, a U. S. -based intellectual property company specializing in semiconductor bonding and interconnect technologies.

AMD isn't finished with Zen 4 processors just yet, with a new X3D offering on the way: Ryzen 5 7500X3D packs 6C/12T, 96MB ...

AMD’s next-gen Ryzen 9 9950X3D2 might just redefine what a gaming CPU can do. With 16 cores, 192MB of stacked L3 cache, and a ...

An Arizona company known for numerical simulation and product development is now venturing into reselling state-of-the-art ...

M5’s next-generation GPU includes a Neural Accelerator in every core, boosting performance dramatically for demanding AI and graphics tasks ...

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...

WSU researchers unveiled 3D-printed antenna arrays with a chip-scale processor, a major breakthrough for flexible wireless ...

It tackles the long-standing problem of signal failure in flexible electronics caused by bending, movement, and environmental ...

Researchers use freezing technology to find how micro-sized particles cause defects in the chip-making process and design better methods to prevent them.

As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between processors and memory. Even ...