Vent Electric announced the release of the nVent SCHROFF Liquid Flow Through Module, used in rugged environments ...
India has approved several electronic component manufacturing projects, underscoring its push up the tech supply chain, while ...
High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member. ...we look forward to contributing to HDP initiatives ...
Aspocomp Group Plc, Stock Exchange Release, November 3, 2025 at 4:20 p.m.The new shares subscribed for in Aspocomp Group Plc’s directed share issue have been registered with the Trade Register.A total ...
A printed circuit board (PCB) is used for electrical interconnection and as a component assembly platform in electronic devices. Aspocomp provides PCB technology design, testing and logistics services ...
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Aspocomp Group Plc: Aspocomp's Board of Directors has approved the company's strategy for 2026-2030
Aspocomp Group Plc, Stock Exchange Release, November 3, 2025, at 9:00 a.m. (UCT+2) Release category: Other information disclosed according to the rules of the Exchange Aspocomp's Board of Directors ha ...
Aspocomp Group Plc, Stock Exchange Release, November 3, 2025 at 9:30 p.m. Aspocomp Group Plc (business ID 1547801-5) received today, on November 3, 2025 a notification of major shareholding, pursuant ...
A significant divergence emerged as Taiwan and China concluded their major PCB industry exhibitions in late October 2025.
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