DIGITIMES

Chinese PCB firms quietly advance next-gen CoWoP packaging

A significant divergence emerged as Taiwan and China concluded their major PCB industry exhibitions in late October 2025.
Opinion
Printed Circuit Design & Fab Online MagazineOpinion

Tried-and-True Design Practices for High PCB Yield

In PCB design, design for manufacturing (DfM) is all about correcting mistakes after reviewing a PCB layout. We then devise corrective actions to fix those mistakes and improve procedures to make ...

Global Photoresists Market to Reach USD 9.88 Billion by 2031, Driven by Semiconductor and AI Advancements | Valuates Reports

The Photoresists Market was valued at USD 6314 Million in the year 2024 and is projected to reach a revised size of USD 9885 ...
IEEE

Experimental Study of PCB Vibration Induced by MLCC Assembly Orientation and Process Variations

Abstract: The piezoelectric effect will cause the multilayer ceramic capacitor (MLCC) to deform in several directions. When it is soldered to the printed circuit board (PCB) and powered on, these ...
IEEE

Low Roughness and Shape Reforming 4H-SiC Trench Process optimized by CCP Etching with High Temperature Annealing and Sacrificial Oxidation

Abstract: This paper focuses on the evaluation of two subsequent process steps—post-trench processing (PTPs) and sacrificial oxidation (SAC)—following the etching of 4H silicon carbide (4H-SiC) ...
C&EN

Competitive Cation Exchange and Etching Processes in Metal Sulfide Nanoparticles from Anion/Ligand Cooperativity and Exogenous Cations

Department of Chemistry, The Pennsylvania State University, University Park, Pennsylvania 16802, United States Department of Chemical Engineering, The Pennsylvania State University, University Park, ...