Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are ...

India has approved several electronic component manufacturing projects, underscoring its push up the tech supply chain, while ...

High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member. ...we look forward to contributing to HDP initiatives ...

High Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member. "International collaboration across market segments is instrumental to address ...

Aspocomp Group Plc, Stock Exchange Release, November 3, 2025 at 4:20 p.m.The new shares subscribed for in Aspocomp Group Plc’s directed share issue have been registered with the Trade Register.A total ...

A printed circuit board (PCB) is used for electrical interconnection and as a component assembly platform in electronic devices. Aspocomp provides PCB technology design, testing and logistics services ...

Aspocomp Group Plc, Stock Exchange Release, November 3, 2025, at 9:00 a.m. (UCT+2) Release category: Other information disclosed according to the rules of the Exchange Aspocomp's Board of Directors ha ...

What if a doorbell never needed a battery and still sent signals wirelessly over long distances. This design can turn every ...

The Production Linked Incentive (PLI) scheme is transforming India's Electronics Manufacturing Services (EMS) sector into a global hub, significantly boosting domestic production and investment. This ...

Aspocomp has carried out a Directed Share Issue and agreed on new long-term financing arrangement to secure growth ...

Aspocomp Group Plc, Stock Exchange Release, November 3, 2025 at 9:30 p.m. Aspocomp Group Plc (business ID 1547801-5) received today, on November 3, 2025 a notification of major shareholding, pursuant ...