Stacking dies introduces layers of complexity driven by multi-physics interactions, which must be addressed at the start of ...
A new study reveals that insulating buffer layers are no longer needed for ultrathin magnetic racetrack devices, unlocking ...
A new study reveals that insulating buffer layers are no longer needed for ultrathin magnetic racetrack devices, unlocking ...
Abstract: In the 3D ferroelectric memory fabrication process, the outer Titanium nitride metal electrode and silicon doped hafnium-based ferroelectric layer will produce void defects at the interfaces ...
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