This review asks whether graphene-based nanosensors could enhance energy efficiency in AI by integrating memory and computation for advanced information processing.

The growth and impact of artificial intelligence are limited by the power and energy that it takes to train machine learning ...

The hunt is on for anything that can surmount AI’s perennial memory wall–even quick models are bogged down by the time and energy needed to carry data between processor and memory. Resistive RAM (RRAM ...

Just like each person has unique fingerprints, every CMOS chip has a distinctive "fingerprint" caused by tiny, random ...

Data center AI is driving a dramatic ramp in the growth of silicon photonics foundries: 8X growth in just 6 years, from 2026 to 2032. Scale-out is the major driver now. Scale-up will become the ...

IC design house PixArt held its earnings call on February 6, reporting that its fourth-quarter 2025 performance largely met expectations, with modest revenue growth. Gross margin, however, declined ...

SAN FRANCISCO — Researchers from CEA-List and CEA-Leti today unveiled at ISSCC the first electro-optical router with dynamic, frame-level optical routing integrated with CMOS control logic, marking a ...

A team at the University of California, San Diego has redesigned how RRAM operates in an effort to accelerate the execution ...

Just like each person has unique fingerprints, every CMOS chip has a distinctive "fingerprint" caused by tiny, random manufacturing variations ...

A total of $45 million was received in Hawk orders from this IDM customer for AI applications to be delivered in 2026MIGDAL HAEMEK, Israel, Feb. 10, 2026 ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

As AI workloads continue to grow rapidly, both scale-up and scale-out architectures are reshaping the requirements of data center connectivity. Cadence emphasized that integrating its high-speed ...