Today’s high-speed PCB and system-level design demands fast, accurate simulation. This ebook explains how to choose the right ...

As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry ...

It was the spring of 1942. America’s back was against the wall. The Japanese Navy ruled the Pacific. Pearl Harbor was still in ruins. In a dim basement beneath Pearl, Commander Joseph Rochefort ...

Abstract: In this paper, we present the concept of traceback analysis to identify the origins of non-wet defects caused by hydrophobic unknown nanoparticles in the semiconductor packaging process.

Abstract: This work proposes a new chip carrier structure to enable the integration of multiple chips. Compared with the solution proposed by Schweizer, the new structure significantly reduces size of ...