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Abstract: This study presents an innovative approach to early detection of wire bond lift-off failures in power semiconductor modules (PSMs) using an integrated on-chip temperature sensor. Despite ...

Abstract: Wire retention force is an important indicator for evaluating the reliability of wire insertion in electrical connectors. Current approaches to measure this force are mainly relied on spring ...

You can create a release to package software, along with release notes and links to binary files, for other people to use. Learn more about releases in our docs.

You can create a release to package software, along with release notes and links to binary files, for other people to use. Learn more about releases in our docs.