As a seasoned tester, the responsibilities in defect management extend beyond the routine tasks of reporting issues and verifying resolutions. While these ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.

Physical defects like shorts and opens may occur during any step of the fabrication process. Well-known fault models like stuck-at (SA), 1 transition (TR), 2 N-detect (ND), 3 gate-exhaustive (GE), 4 ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...