Teradyne rides on a 45% semiconductor test revenue surge fueled by AI compute, with 2026 growth tied closely to booming AI ...

NORTH READING, Mass.--(BUSINESS WIRE)--Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, is proud to announce the launch of the Magnum 7H, a ...

The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in ...

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

High-bandwidth memory (HBM) is an important part of AI processors, handling massive data processing and computations. In response, Teradyne, Inc. has launched the Magnum 7H, a next-generation memory ...

Keysight Technologies has introduced a set of validation solutions to help operators manage bandwidth limits, latency issues, ...

Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...

Samsung moves up its HBM4 production schedule and begins preparing for mass output of next generation high bandwidth memory chips. Nvidia chooses Samsung, not Micron Technology (NasdaqGS:MU), as a ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...

Memory-maker Micron says it is close to securing customers for all the high-bandwidth memory (HBM) it will make next year. Unsurprisingly, the company also predicts it will enjoy improved profit ...