Samsung ships HBM4 memory at 11.7Gbps speeds and claims an early industry lead ...

The global High Bandwidth Memory (HBM) market is experiencing explosive growth driven by AI demand. The industry is heavily investing in 3D-stacked memory architecture (TSV technology) and advanced ...

MU, has begun high volume production and ahead of schedule shipments of its HBM4 memory chips. The company reports that all ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in ...

Samsung Electronics announced Thursday it had started mass production of next-generation memory chips to power artificial intelligence, touting an "industry-leading" breakthrough.

Samsung Electronics expects strong demand for memory chips to remain robust throughout this year and extend into next year, ...

Western Digital is introducing a couple of new technologies, dubbed "High Bandwidth Drive" and "Dual Pivot", that will significantly boost the performance of hard drives. According to Western Digital, ...

Professor Kim Joung-ho of the Korea Advanced Institute of Science and Technology (KAIST), known for devising the basic ...

AMD submitted a patent to the World Intellectual Property Organization (WIPO) for a groundbreaking new memory architecture that can significantly enhance the performance of the DDR5 standard. The ...

Interconnect technology in high bandwidth memory (HBM) is at a fork in the road. One direction leads to tried-and-true microbump technology, and the other leads to a compelling alternative, hybrid ...

By Arsheeya Bajwa Feb 12 (Reuters) - Applied Materials forecast second-quarter revenue and profit above market estimates on ...