Nashua, N.H. – Teradyne Connection Systems' newest interconnect offering, the very high-density metric (VHDM) six-row stacking connector, provides a press-fit solution for stacking applications such ...
Additive manufacturing (AM) is evolving beyond prototyping to enable end-use parts production across a range of applications. Much has changed to enable this, including the development of AM processes ...
Based on chip-scale packaging (CSP), a new lead-free DRAM stacking technology enables the design and manufacture of cost-effective, high-density DRAM modules for large servers, telecom switches, and ...
Moore’s Law scaling is slowing down and limited improvements in performance, power, area, and cost are available from one process node to the next. As a result, advanced packaging and 3D stacking ...
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