TOKYO — During the Semicon Japan trade show here today, nLine Corp. rolled out its first product–a wafer inspection tool, based on a new and radical holographic imaging technology. The new ...

(click to enlarge) An automated process makes it easier to spot broken or cracked struts, a bad laser cut, or an uneven electropolish. Throughout their history, stents have been beset by challenges to ...

The first SWIR line scan camera from Teledyne DALSA offers up to 74 dB dynamic range and spectral response from 950 to 1700 nm With exceptional responsivity and low noise, this newest Linea SWIR line ...

Teledyne DALSA introduces its Linea ML 8k multispectral CLHS line scan camera for improved defect detectability with a single scan. Teledyne DALSA, a Teledyne Technologies [NYSE:TDY] company, is ...

Business competition pressures manufacturers to produce faster, reduce expenses, and increase efficiencies. But all these requirements run into the quality control issue sooner or later — with the ...

Wafers can be inspected for large, obvious defects, or for small, subtle ones. The former is referred to as macro-inspection, while the latter is micro-inspection. These processes use different ...

Borescopic visual inspection may be appropriate for small parts with areas not visible to the naked eye. Even with all the high-tech testing and inspection techniques in use today, basic visual ...

MILPITAS, Calif.--(BUSINESS WIRE)--Today KLA-Tencor Corporation (NASDAQ:KLAC), the world’s leading supplier of process control and yield management solutions for the semiconductor and related ...

Manufacturers of aviation engine components are being impacted by Industry 4.0's emphasis on quality control. Industry 4.0 is challenging these manufacturers to rethink outdated QC processes and ...