System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

The performance of the final product depends heavily on the degree of cure - making it critical to ensure that the reaction goes to completion for the highest quality and reliability. Achieving this ...

Injection overmolding of unidirectional fibers and preforms is an attractive process for many good reasons. It’s fast, consistent and repeatable, and it can be performed with a machine that is ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...