Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...
AMD isn't finished with Zen 4 processors just yet, with a new X3D offering on the way: Ryzen 5 7500X3D packs 6C/12T, 96MB ...
A new power supply technology for 3D-integrated chips has been developed using a vertically stacked architecture, where processing units are positioned directly above dynamic random access memory ...
BBCube™: Bumpless Build Cube. A bumpless three-dimensional semiconductor integrating technology can address the challenges posed by traditional system-in-package (SiP) approaches. A novel power ...
AMD’s next-gen Ryzen 9 9950X3D2 might just redefine what a gaming CPU can do. With 16 cores, 192MB of stacked L3 cache, and a ...
WSU researchers unveiled 3D-printed antenna arrays with a chip-scale processor, a major breakthrough for flexible wireless ...
REZZATO, Italy--(BUSINESS WIRE)--ARIA Sensing proudly announces the launch of "Hydrogen," a groundbreaking Ultra-Wideband (UWB) Radar System-On-Chip (SoC) that sets a new industry benchmark as the ...
Early-stage disease diagnosis relies on the highly sensitive detection of biomarkers. Optical whispering-gallery-mode (WGM) microcavity sensors have emerged as a highly promising technology for ...
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